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Huawei showcases next-generation high performance computing solutions at the International Supercomputing Conference
Jul 16, 2015 17:00

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Huawei showcases next-generation high performance computing solutions at the International Supercomputing Conference

[Frankfurt, Germany, July 16, 2015] Huawei showcased its next-generation high performance computing (HPC) products and solutions at the 2015 International Supercomputing Conference (ISC).

During the five-day event, Huawei also partnered with University of Science and Technology of China to participate in the 4th HPCAC-ISC Student Cluster Competition (SCC).

Huawei’s HPC products and solutions focus on improving energy efficiency and cost performance

Huawei showcased a range of industry-leading HPC products and solutions at the ISC, demonstrating improved system efficiency for hardware, software and services based on Huawei’s high energy efficiency design concept. In total five products and solutions were showcased, including the FusionServer X6800 Data Center Server, the E9000 V3 Blade Server, E9000 liquid cooling system, OceanStor 9000 Big Data Storage System and the next-generation PCIe SSD Card with 20-nm NAND flash.

Huawei FusionServer X6800 Data Center Server is designed for HPC scenarios which require an innovative architecture. The server adopts a 4U chassis which is capable of integrating either eight 1U servers or four 2U servers to achieve double server density when compared to traditional 1U rack servers, reducing energy consumption by 10%, and lowering the total cost of ownership by 20%. Huawei FusionServer X6800 Data Center Server realizes the architecture innovation and optimization for servers that are designed for HPC applications without changing the existing ecosystem.

Targeting the HPC scenarios which require high-density computing, Huawei showcased two board-level liquid cooling solutions, the E9000 V3 Blade Server and E9000 liquid cooling system. The E9000 V3 Blade Server is powered by the latest Intel® processors and integrates computing, storage, switching, and management subsystems to form a powerful converged infrastructure platform. The E9000 liquid cooling system leverages warm water cooling technology to achieve 45KW heat dissipation per single cabinet when combined with two of Huawei’s Tecal E9000 high-density blade servers the CH121 and CH140. Through adopting warm water cooling technology, Huawei’s liquid cooling solutions are able to support up to 40°C water inlets, reducing the need for cold water coolers in conjunction with improving operational efficiency.

The recent increase in service demands has resulted in several challenges for HPC products and solutions, including data storage bottlenecks, life cycle management, and limited storage expansion capabilities. In order to meet the data center demands, the Huawei OceanStor 9000 Big Data Storage System supports read and write technology with bandwidth up to 200 Gbit/s. This technology supports five million network file system input/output operations per second (IOPS) and 60 PB capacity expansion. Huawei OceanStor 9000 Big Data Storage System reduces management complexity through integrating the management of data storage, analysis, and archiving to prevent frequent data loading and migration across devices. The data analysis and retrieval interfaces on the Huawei OceanStor 9000 Big Data Storage System shifts data analysis workloads to below the service system, relieving pressure at the upper computing layer and improving overall HPC efficiency.

Huawei partnered with University of Science and Technology of China for the 4th HPCAC-ISC Student Cluster Competition

Huawei provided the team from University of Science and Technology of China with FusionServer X6800 Data Center Servers for the 4th HPCAC-ISC Student Cluster Competition. The Huawei X6800 high-density servers adopted Mellanox IB EDR switches and NVIDIA K80 GPU accelerators to provide a platform which supported five different applications for the competition. This partnership demonstrated the adaptability of Huawei servers to various application scenarios and the latest hardware devices in the industry.

Huawei leverages its strong and extensive R&D capabilities to drive the HPC industry

Huawei’s HPC expert Francis Lam, IT Hardware Architect at the Huawei U.S. R&D center delivered a speech entitled ‘Huawei’s Innovation-driven High Performance Computing Solutions’ during the exhibitor forum and vendor showdown sessions.

Francis Lam delivered a speech

In his speech he shared Huawei’s insights in HPC technology trends and research findings in this field with the audience. He referred to society becoming more intelligent which has resulted in traditional HPC solutions being unable to satisfy the customers’ requirements due to the lack of flexibility and workload-based optimization capabilities. On the Huawei research in this field he said, “Huawei provides its customers with diverse, agile and optimized end-to-end HPC solutions through integrating infrastructure, hardware resources, system environments, cluster management, service platforms, and industrial applications. Huawei leverages its strong and extensive R&D capabilities to enable end-to-end innovation from chips and systems to support the HPC industry with the optimal computing capabilities despite having limited resources."

Huawei showcased its next-generation HPC solutions at the International Supercomputing Conference.

Guan Jun, Director of Enterprise Business Group in Eastern and Northern Europe, Huawei, said, “Huawei is committed to meeting customer needs through technology innovation and cooperating with partners to provide professional life cycle management services ranging from consultation and planning, construction and deployment, migration and integration, custom development, to disaster preparedness. Our participation in this flagship event showcases the breakthroughs Huawei has made in HPC and our ongoing investment in the field.”

The ISC 2015 takes place from 12 to 16 July 2015 in Frankfurt, Germany. During the five day event, 2,600 attendees from the HPC and scientific computing communities meet with 160 exhibitors to share ideas, make connections and see the latest product developments. For more information and to experience the Huawei HPC products and solutions visit booth 1126.

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